COB LED (Chip on Board) is an advanced LED packaging technology that integrates multiple LED chips into a single module, offering high brightness, low power consumption, and uniform lighting. Compared to SMD LEDs, COB LEDs provide superior heat dissipation, efficiency,

This comprehensive guide compares MIP and COB LED display technologies for small pixel pitch applications. Explore technical differences, performance metrics, cost analysis, and industry-specific recommendations. Includes comparison tables and expert insights to help you choose the right solution.

This article provides a comprehensive comparison of MIP and COB small-pitch LED displays. It covers their key differences, advantages, disadvantages, and application scenarios. The guide also explores the cost factors involved and helps you decide which technology suits your needs

LED display technology relies on various packaging methods to ensure optimal performance. This article explains the benefits and drawbacks of key packaging types—DIP, SMD, GOB, COB, IMD, MIP, and COG. We will also guide you on choosing the best packaging

Understanding LED pixel pitch is essential for selecting the best display. Learn how pixel pitch affects resolution, viewing distance, and the best choices for various applications. This guide will help you make informed decisions for both indoor and outdoor setups.

At ISE 2025 Barcelona, MIP LED displays take center stage with their breakthrough technology. Exhibitors like ROE Visual, LPDISPLAY, and Unilumin showcase the latest in Mip LED and Micro LED solutions, revolutionizing the LED display industry. These innovations emphasize energy